CyberPowerPC Microphone MPC603EC Manuel d'utilisateur

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MPC603EC/D
(Motorola Order Number)
5/95
REV 2
MPR603HSU-03
(IBM Order Number)
The PowerPC name, PowerPC logotype, PowerPC Architecture, and PowerPC 603 are trademarks of International Business Machines Corp.
used by Motorola under license from International Business Machines Corp.
This document contains information on a new product under development by Motorola and IBM. Motorola and IBM reserve the right to
©
Motorola Inc. 1995
Instruction set and other portions
©
International Business Machines Corp. 1991–1995
603 Hardware Specifications
change or discontinue this product without notice.
Advance Information
PowerPC
603
RISC Microprocessor
Hardware Specifications
The PowerPC 603 microprocessor is an implementation of the PowerPC™ family of
reduced instruction set computer (RISC) microprocessors. This document contains
pertinent physical characteristics of the 603. For functional characteristics of the processor,
refer to the
PowerPC 603 RISC Microprocessor User’s Manual.
This document contains the following topics:
Topic Page
Section 1.1, “Overview” 2
Section 1.2, “General Parameters” 4
Section 1.3, “Electrical and Thermal Characteristics” 4
Section 1.4, “Pinout Diagram” 14
Section 1.5, “Pinout Listing” 15
Section 1.6, “Package Description” 17
Section 1.7, “System Design Information” 21
Section 1.8, “Ordering Information” 26
Appendix A, “General Handling Recommendations for the IBM Package” 27
In this document, the term “603” is used as an abbreviation for the phrase, “PowerPC 603
Microprocessor.The PowerPC 603 microprocessors are available from Motorola as
MPC603 and from IBM as PPC603.
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Résumé du contenu

Page 1 - Advance Information

MPC603EC/D(Motorola Order Number) 5/95REV 2 MPR603HSU-03(IBM Order Number) The PowerPC name, PowerPC logotype, PowerPC Architecture, and PowerPC 603

Page 2 - 1.1 Overview

10 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 14a SYSCLK to output valid (5.5 V to 0.8 V— all except TS, ABB, ARTR

Page 3

603 Hardware Specifications, REV 2 11Preliminary—Subject to Change without Notice Figure 4. Output Timing DiagramSYSCLK121413151616ALL OUTPUTS(Except

Page 4 - 1.2 General Parameters

12 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 1.3.3 JTAG AC Timing SpecificationsTable 8 provides the JTAG AC timi

Page 5

603 Hardware Specifications, REV 2 13Preliminary—Subject to Change without Notice Figure 6 provides the TRST timing diagram. Figure 6. TRST Timing Dia

Page 6

14 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 1.4 Pinout DiagramFigure 9 contains the pin assignments for the 603

Page 7

603 Hardware Specifications, REV 2 15Preliminary—Subject to Change without Notice 1.5 Pinout ListingTable 9 provides the pinout listing for the 603.T

Page 8 - ≤ 105 °C

16 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice HRESET 214 Low InputINT188 Low InputLSSD_MODE1205 Low InputL1_TSTCLK

Page 9 - ALL INPUTS

603 Hardware Specifications, REV 2 17Preliminary—Subject to Change without Notice Notes:1. These are test signals for factory use only and must be pul

Page 10

18 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 1.6.1.2 Mechanical Dimensions of the Motorola Wire-Bond CQFP Packag

Page 11 - VM = Midpoint Voltage (1.4 V)

603 Hardware Specifications, REV 2 19Preliminary—Subject to Change without Notice 1.6.2 IBM C4-CQFP Package DescriptionThe following sections provide

Page 12

2 603 Hardware Specifications, REV 2 Preliminary—Subject to Change without Notice 1.1 Overview The 603 is the first low-power implementation of the

Page 13 - Figure 6. TRST Timing Diagram

20 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 1.6.2.2 Mechanical Dimensions of the IBM C4-CQFP PackageFigure 11 s

Page 14 - 1.4 Pinout Diagram

603 Hardware Specifications, REV 2 21Preliminary—Subject to Change without Notice 1.7 System Design InformationThis section provides electrical and t

Page 15 - 1.5 Pinout Listing

22 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 1.7.2 PLL Power Supply FilteringThe AVdd power signal is provided o

Page 16

603 Hardware Specifications, REV 2 23Preliminary—Subject to Change without Notice Figure 13 provides a thermal management example for the Motorola wir

Page 17 - 1.6 Package Description

24 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice Notes: 1. Junction-to-ambient thermal resistance is based on measure

Page 18

603 Hardware Specifications, REV 2 25Preliminary—Subject to Change without Notice Figure 14 provides a thermal management example for the IBM C4-CQFP

Page 19 - 1.6.2.1 Package Parameters

26 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 1.8 Ordering InformationThis section provides the ordering informat

Page 20 - * Not to scale

603 Hardware Specifications, REV 2 27Preliminary—Subject to Change without Notice Appendix AGeneral Handling Recommendations for the IBM PackageThe fo

Page 21 - 1.7.1 PLL Configuration

28 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice A.2 Card Assembly RecommendationsThis section provides recommendatio

Page 22 - °C/Watt (junction-to-case)

603 Hardware Specifications, REV 2 29Preliminary—Subject to Change without Notice Clean after reflow De-ionized (D.I.) water if water-soluble paste is

Page 23

603 Hardware Specifications, REV 2 3 Preliminary—Subject to Change without Notice • Five independent execution units and two register files— BPU fea

Page 24

Information in this document is provided solely to enable system and software implementers to use PowerPC microprocessors. There are no express or imp

Page 25

4 603 Hardware Specifications, REV 2 Preliminary—Subject to Change without Notice 1.2 General Parameters The following list provides a summary of

Page 26 - PPC 603 – F X– 0XX– X

603 Hardware Specifications, REV 2 5 Preliminary—Subject to Change without Notice Table 3 provides the DC electrical characteristics for the 603.Ta

Page 27 - IBM Package

6 603 Hardware Specifications, REV 2 Preliminary—Subject to Change without Notice 1.3.2 AC Electrical Characteristics This section provides the cl

Page 28 - A.2.1 Card Assembly Process

603 Hardware Specifications, REV 2 7 Preliminary—Subject to Change without Notice Figure 1. SYSCLK Input Timing Diagram 1.3.2.2 Input AC Specificat

Page 29

8 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice Table 6. Input AC Timing Specifications Vdd = 3.3 ± 5% V dc, GND = 0

Page 30

603 Hardware Specifications, REV 2 9Preliminary—Subject to Change without Notice Figure 2. Input Timing DiagramFigure 3. Mode Select Input Timing Dia

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